Ansys enables 3d multiphysics visualization of next-generation 3d-ic designs with nvidia omniverse

Ansys to demonstrate 3d multiphysics visualization of electromagnetic and thermal effects in semiconductor packages at design automation conference  / key highlights existing ansys capabilities with nvidia omniverse platform supercharge 3d integrated circuit (3d-ic) design by enabling designers to optimize semiconductor chips within the context of a system-on-a-chip by transforming data into meaningful visual insights, the ansys multiphysics platform empowers ic designers to interact with models of electromagnetic fields and thermal effects for faster diagnostics and optimization pittsburgh, june 19, 2024 /prnewswire/ -- ansys  (nasdaq: anss) today announced that it is adopting nvidia omniverse  application programming interfaces (apis) to offer 3d-ic designers valuable insights from ansys' physics solver results through real-time visualization. ansys is ushering in the next generation of semiconductor system design to improve outcomes in applications including 5g/6g, internet of things (iot), artificial intelligence (ai)/machine learning (ml), cloud computing, and autonomous vehicles.
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