Ansys multiphysics solutions achieve certification for tsmc n4 process and tsmc finflex™ architecture

Ansys is certified for tsmc's innovative finflex ™ architecture on n3e for flexible power/performance tradeoffs / key highlights ansys® redhawk-sc™ and ansys® totem™ power integrity platforms are certified for tsmc's finflex™ architecture on n3e the certification also extends to the tsmc n4 process technology pittsburgh , oct. 28, 2022 /prnewswire/ -- ansys (nasdaq: anss) and tsmc continued their long-standing technology collaboration to announce certification of ansys' power integrity software for tsmc's finflex™ innovation as well as the tsmc n4 process. tsmc's finflex™ architecture allows ansys redhawk-sc and totem customers to make fine-grained speed-power tradeoffs which reduce a chip's power footprint without sacrificing performance.
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