Applied materials advances heterogeneous chip integration with new technologies for hybrid bonding and through-silicon vias

Santa clara, calif., july 10, 2023 (globe newswire) -- applied materials, inc. today introduced materials, technologies and systems that help chipmakers integrate chiplets into advanced 2.5d and 3d packages using hybrid bonding and through-silicon vias (tsvs). the new solutions extend applied's industry-leading breadth of technologies for heterogeneous integration (hi).
AMAT Ratings Summary
AMAT Quant Ranking