Applied materials breakthrough in electron beam imaging technology accelerates development of the world's most advanced computer chips

Santa clara, calif., dec. 14, 2022 (globe newswire) -- applied materials, inc. today announced the commercial availability of “cold field emission” (cfe) technology, a breakthough in ebeam imaging that enables customers to better detect and image nanometer-scale, buried defects to speed the development and production of next-generation gate-all-around (gaa) logic chips as well as higher-density dram and 3d nand memories.
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