Applied materials unveils next-gen chipmaking products to supercharge ai performance

Santa clara, calif., oct. 07, 2025 (globe newswire) -- applied materials, inc. today introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to ai computing. the new products target three critical areas in the race to deliver ever more powerful ai chips: leading-edge logic including gate-all-around (gaa) transistors, high-performance dram including high-bandwidth memory (hbm), and advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost.
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