Applied materials accelerates chip defect review with next-gen ebeam system

Santa clara, calif., feb. 19, 2025 (globe newswire) -- applied materials, inc. today introduced a new defect review system to help leading semiconductor manufacturers continue pushing the limits of chip scaling. the company's semvision™ h20 system combines the industry's most sensitive electron beam (ebeam) technology with advanced ai image recognition to enable better and faster analysis of buried nanoscale defects in the world's most advanced chips.
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