Applied materials announces new collaboration model for advanced packaging at summit on energy-efficient computing

Santa clara, calif. and singapore, nov. 18, 2024 (globe newswire) -- applied materials, inc. today announced plans to expand its global epic* innovation platform with a new collaboration model specifically designed to accelerate commercialization of advanced chip packaging technologies. to kick-off the initiative, applied convened more than two dozen top r&d leaders from the semiconductor industry to encourage alliances between equipment makers, material providers, device companies and research institutes. the goal is to fast-track new technologies for the next generation of energy-efficient computing. applied hosted the summit in singapore, where the company has been collaborating on advanced packaging r&d with its customers and partners for over a decade.
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