Aehr test systems receives follow-on orders of over $6 million for fox-xp test and burn-in system and waferpaks for silicon photonics devices

Aehr test systems announced it has received follow-on orders of over $6 million from one of its lead fox-xp test and burn-in system customers for a fox-xp multi-wafer test and burn-in system and multiple waferpak contactors to provide additional high-volume test capacity for the customer’s increasing silicon photonics device production requirements. the fox-xp system and waferpak contactors are expected to ship prior to the end of aehr’s next fiscal quarter ending february 29, 2020. the fox-xp system is configured with nine fox-p™ independent testers respectively, each with their own independent test system, test interface, and conductive thermal chuck, and are able to test up to nine wafers of up to 2kw of power each for a total of 18kw per system, which enables full wafer test of all devices on the wafer in a single touchdown. aehr’s fox-xp system is the company’s multi-wafer and singulated die/module test solution that is capable of functional test and burn-in/cycling of integrated photonics devices, flash memories, microcontrollers, sensors, power, and other leading-edge integrated circuits (ics) in wafer form before they are assembled into single or heterogenous stacked packages. the fox-xp system is designed for high-volume production and can be configured to test and burn in up to 18 wafers simultaneously. the resulting known-good die (kgd) can then be used for high quality and reliability applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors.
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