Adeia's pioneering hybrid bonding technology continues to capture attention

San jose, calif., june 12, 2024 (globe newswire) -- today, adeia inc. (nasdaq: adea), a leading r&d and intellectual property (ip) licensing company known for bringing leading innovations in the semiconductor and media/entertainment technology sectors to market, announced recent developments in hybrid bonding a technology targeted toward the future of semiconductor packaging enabling high-performance computing capabilities, like those required for ai.
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