Acm research receives orders from a leading global idm for wet stripping systems for wafer-level packaging

Fremont, calif., nov. 04, 2021 (globe newswire) -- acm research, inc. (acm) (nasdaq: acmr), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (wlp) applications, today announced receipt of two orders for acm's ultra c pr wet stripping system from a leading global integrated device manufacturer (idm). the idm plans to deploy these tools in its china-based advanced packaging manufacturing facility for ease of use in photoresist (pr) removal in wlp applications. the first tool was delivered in october of 2021, and the second order is scheduled to be delivered in the first quarter of 2022.
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