Acm research ships its first 300mm, high-temp single-wafer spm tool for advanced logic, dram and 3d-nand semiconductor manufacturing

Fremont, calif., sept. 23, 2021 (globe newswire) --  acm research, inc. (acm) (nasdaq: acmr), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (wlp) applications, today announced it has shipped its first 300mm single-wafer sulfuric peroxide mixture systems (single-wafer spm tool) for wet clean and etch processes in advanced logic, dram and 3d-nand integrated circuit manufacturing. acm's new single-wafer spm tool targets high ion dose doped photoresist (pr) wet strip processes, with support for metal etch or strip processes. this new tool extends acm's spm product offering to include higher temperature spm steps that are emerging for more advanced production nodes at 10nm and beyond.
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